Photonics Process Engineer - Operations

The application window is expected to close on: 08/28/2025.

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Meet the Team

You will be working with Acacia's sophisticated silicon photonics operations group, collaborating with teams from Hardware Engineering, Quality, and Product Operations.

Help our teams deploy class leading new technology in record time! Your process engineering skills and knowledge of optics assembly are critically needed to introduce Acacia's next-generation silicon photonic products.

You will work with groundbreaking optics technology, both free-space and PIC. You will refine our high accuracy die-bond applications. You will introduce new products following DFM and PFMEA best practices.

You will guide our manufacturing partners to lower costs by improving efficiency and implementing SPC.

You should be accustomed to working independently to achieve goals. Your communication and listening skills will be the key to success in Acacia and Cisco. Attention to detail is essential, as you will be documenting manufacturing methods and ensuring ISO compliance.

Your background must include experience with micro-optic alignment and assembly, as well as experience with failure analysis to improve manufacturing quality.

There will be occasional weekend support required, and you should be ready for limited (up to 15%) travel to international partner locations.

• BS or MS in Optical/Mechanical Engineering, Physics, or Material Science.
• Five years' experience with optical component assembly in volume manufacturing.
• Process expertise in fiber alignment, laser welding, high precision die-bonding.
• Prior experience with epoxies, knowledge of issues regarding out-gassing, seam sealing, damp heat, temperature cycling and optical stability tests.

• Familiarity with electrical and optical data test platforms, concepts along with knowledge of opto-electronic components, multi-chip on carrier processes, underfill processes and other applicable processes related to the fabrication of PIC and Optical Engine-based devices.
• Materials knowledge of photonic components, adhesives, ceramics, fibers, metals, fatigue strength.
• Experience with advanced packaging, including flip-chip and non-hermetic assemblies.
• Design of experiments, principles of process control, SPC tools (JMP or similar).

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